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Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

Shenzhen Ruidian Electric Co. , Ltd
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    Buy cheap Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar from wholesalers
     
    Buy cheap Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar from wholesalers
    • Buy cheap Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar from wholesalers

    Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

    Ask Lasest Price
    Model Number : SMT spare parts Tin Lead Free Solder Welding Dim Bar
    Price : negotiation
    Payment Terms : T/T
    Supply Ability : 1000pcs/days
    Delivery Time : 8days
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    Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

    SMT spare parts Tin Lead Free Solder Welding Dim Bar Sn/AG/Cu Sn/Cu Sn/AG


    Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice:


    Alloy composition (wt.%)DiameterFlux ContentWeight / RollMelting pointºCWorking pointUsage & Application
    TypeTin-SnSilver-AgCopper-Cu
    SAC30596.50%3.00%0.50%0.8-3.0mm1.8-2.4%750-1000g217-219280-320LED, IT, PCB, High-class electronics, Lighting industry, Radiators, Household appliance and Precise Instruments, Audio and Sound System and other soldering
    SAC30097.00%3.00%0%217-220280-320
    SAC030799.00%0.30%0.70%217-225260-320
    SAC0799.30%0.00%0.70%227260-280
    • Anti-oxidation tin lead free bar
    • High temperature tin lead free bar
    • Low temperature tin lead free bar
    • Dim tin lead free bar
    • Silver tin lead free bar
    • Tin lead free solder bar for other particular applications
    • 3.15cm * 1.5cm * 1.0cm

      500g/PC

      • Eutectic alloy.
      • Bridge-free and icicle-free soldering.
      • Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
      • Good through-hole penetration.
      • Good topside fillet formation.
      • Dross rate equal or lower than tin-lead solder.
      • Does not require a nitrogen atmosphere.
      • Does not erode copper from holes, pads and tracks.
      • Low rate of copper leaching makes it easy to control the copper content of the solder bath.
      • Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
      • Thermal fatigue resistance and creep strength better than tin-lead.
      • Slow, even growth of the intermetallic layer at the solder/substrate interface.
      • Also performs well in selective and dip soldering.

    Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar


    Quality Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar for sale
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